Warrick County School Corp. Sharon Elem. School Second Floor Exterior Ramps Replacement Project.
Status
Accepting Bids
| Prebid Date | 4/23/25 8:30am |
| Bid Date | 5/7/25 9:30am |
Company & Contacts
Notice is hereby given that the Warrick County School Corporation will receive sealed bid proposals at the Warrick County School Corporation Administration Building, 300 East Gum Street, Boonville, Indiana in Meeting Room B, Second Floor, for the furnishing of all materials and labor for the Warrick County School Corporation Sharon Elementary School Second Floor Exterior Ramps Replacement Project. Bids will be opened and read publicly after bids are received.
Project: Warrick County School Corporation Sharon Elementary School Second Floor Exterior Ramps Replacement Project.
Project Description: The Project includes the complete removal of two (2) existing second floor exterior ramps; one located on the south side of the school and the other located on the north side. Both ramps are currently of all concrete construction- ramps, landings, elevated slabs, ramp walls, and columns. The replacement ramps will be of a similar construction with the exception of steel pipe guard and handrails in lieu of concrete walls and will be slightly narrower. The project will also include some site grading, sidewalk connections, and site lighting.
There will be a Pre-Bid Meeting at the Warrick County School Corporation Administration Building on Wednesday, April 23, 2025, at 8:30 A.M. Central Time in Meeting Room B, Second Floor. Please arrive at least 10 minutes prior to the scheduled meeting time to allow for the required visitor check-in process.
Bids will be received until 9:30 A.M. Central Time on Wednesday, May 7, 2025, at the Warrick County School Corporation Administration Building. The bids will be opened and read aloud directly thereafter in Meeting Room B, Second Floor.
Bid Documents for a Stipulated Sum contract may be obtained from Maco-Evansville Blue, 600 Court Street, Evansville, Indiana, 47708 at the Bidder’s cost. No partial sets of Plans and/or Specifications will be distributed. If mailing is required, mailing costs shall be paid for by the Bidder. The Bidder shall refer to the Instructions to Bidders for additional bidding procedures and requirements.